LMC555CBP,丝印代码:xxF+1,封装:BPA08EFB,厂家: - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:LMC555CBP
丝印代码:xxF+1
厂家:
封装:BPA08EFB
脚针数:8
描述:查看更多(View More)
BOM: