MSP430F2618TZQW,丝印代码:M430F2618T,封装:BGA-113,厂家: - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:MSP430F2618TZQW
丝印代码:M430F2618T
厂家:
封装:BGA-113
脚针数:113
描述:查看更多(View More)
BOM: