HZM22N B1,丝印代码:221 (2),封装:MPAK-3,厂家:Renesas(Hitachi) - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:HZM22N B1
丝印代码:221 (2)
厂家:Renesas(Hitachi)
封装:MPAK-3
脚针数:0
描述:查看更多(View More)
BOM: