BR262W30A103E1G,丝印代码:BR262+W30,封装:WLCSP2.3x2.4-30 - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:BR262W30A103E1G
丝印代码:BR262+W30
厂家:
封装:WLCSP2.3x2.4-30
脚针数:0
描述:查看更多(View More)
BOM: