MSP430F6637IZQW,丝印代码:M430F6637,封装:BGA-113 - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:MSP430F6637IZQW
丝印代码:M430F6637
厂家:
封装:BGA-113
脚针数:0
描述:查看更多(View More)
BOM: