RP132S181D5,丝印代码:Q02+Dxx,封装:HSOP-6J - 芯片丝印反查网

marking code, top mark, smd code, device marking, top marking, device code
型号:RP132S181D5
丝印代码:Q02+Dxx
厂家:
封装:HSOP-6J
脚针数:0
描述:查看更多(View More)
BOM: